|
|
Poster Session 1: Integration |
|
|
P3 |
„FUNDAMENTAL ANALYSIS OF THE COLLAPSE OF NANO-PATTERNS DURING WET-PROCESSING OF ADVANCED INTERCONNECTS”
Houman Zahedmanesh, Quoc Toan Le, Kris Vanstreels, Mario Gonzalez, Zsolt Tőkei imec, Kapeldreef 75, Leuven, 3001, Belgium
|
P47 |
“TITANIUM OXIDE AS A HARDMASK MATERIAL CANDIDATE FOR PATTERN TRANSFER”
Archana Subramaniyan, Vishal Chhabra, Sri Charan Vemula, Guowei Xu, Tyler O’Connor, David Conklin, Balaji Kannan, Jinping Liu GLOBALFOUNDRIES, 400 Stone Break Rd Extension, Malta, NY 12020 |
P48 |
„ENHANCED MIMCAP DEVICE USING STACKED ELECTRODE/SIDE CONTACT INTEGRATION SCHEME: SIDE CONTACT PATTERNING (LITHOGRAPHY AND ETCH) OPTIMIZATION STUDY”
Prakash Periasamy, Mohammud Noor, Rui Chen, Meena Rajachidambaram, Esther Fung, ZhiGuo Sun, Chun Hui Low, Wei Hua Tong, Anbu Selvam Mahalingam, Craig Child GLOBALFOUNDRIES INC., Malta, New York, USA |
P55 |
„INTEGRATION SCHEME AND 3D RC EXTRACTIONS OF THREE-LEVEL SUPERVIA AT 16 NM HALF-PITCH” Anshul Gupta1, Jürgen Bömmels1, Yves Saad2, Ivan Ciofi1 and Christopher J. Wilson1 1IMEC, Leuven, Belgium. 2Synopsys, Zurich, Switzerland. |
|
|
Poster Session 2: 3D Integration and Packaging |
|
|
P10 |
„EFFECT OF SURFACE FINISH METALLIZATION ON MECHANICAL STRENGTH OF AG SINTERED JOINT”
Jong-Hoon Back1,2, Byung-Suk Lee1, Seung-Boo Jung2,a) and Jeong-Won Yoon1,3,b) 1Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH), 156 Gaetbeol-ro, Yeonsu-gu, Incheon 21999, Korea 2School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do 16419, Korea 3Critical Materials and Semiconductor Packaging Engineering, University of Science and Technology (UST), 217 Gajeong-ro, Yuseong-gu, Daejeon 34113, Korea |
P36 |
„NEW APPROACH TO INVESTIGATE WETTABILITY AND STABILITY OF CAPPING LAYERS ON UBMS FOR 3D STACKING APPLICATIONS”
Lin Hou1,2, Jaber Derakhshandeh1, Pieter Bex1, Giovanni Capuz1, Myriam Van De Peer1, Teng Wang1, Shamin Houshmand Sharifi1,3, Inge De Preter1, Kenneth June Rebibis1, Gerald Beyer1, Eric Beyne1, Ingrid De Wolf1,2 1) imec, Kapeldreef 75, 3001 Leuven, Belgium 2) Dept. Material Engineering, KU Leuven, Leuven, Belgium 3) Technical University of Dresden (TU Dresden), Dresden, 01069, Germany |
P51 |
„THE RELIABILITY ASSESSMENT OF HYBRID SILVERPASTEJOINTS AS DIE ATTACH MATERIALS IN A HIGH TEMPERATURE ENVIRONMENT”
Bum-Geun Park1,Jae-JungMoon2,Byunghoon Lee3, Ja-Myeong Koo3, Seung-Boo Jung2* 1SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University 2School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, 16419, Republic of Korea 3Manufacturing Core Technology Team, Global Technology Center, Samsung Electronics, 129 Samsung-ro, Yeongtong-gu, Suwon, 16677, Republic of Korea |
P54 |
“DEEP SILICON ETCHING IN CRYO PROCESS FOR TSV 3D INTEGRATION”
A.V. Miakonkikh1, A.E. Rogozhin1, A.A. Tatrintsev1, O.P.Gushin2, K.V. Rudenko1, V.F. Lukichev1 1. Institute of Physics and Technology RAS, Nakhimovsky av. 34, Moscow 117535, Russia. 2. Molecular Electronics Research Institute,1st Zapadny Proezd 12/1, Zelenograd, Moscow 124460,Russia
|
|
|
Poster Session 3: Dielectrics |
|
|
||
P26 |
“PARYLENE AS A DIELECTRIC MATERIAL FOR MEMS APPLICATIONS”
F. Selbmann1,2, L. Hofmann1, M. Baum1, F. Roscher1, M. Wiemer1, S. E. Schulz1,3, Y. Joseph2, T. Otto1,3 1Fraunhofer Institute for Electronic Nano Systems, ENAS, Technologie-Campus 3, 09126 Chemnitz, Germany 2TU Bergakademie Freiberg, Institute for Electronic and Sensor Materials, Gustav-Zeuner-Straße 3, 09599 Freiberg, Germany 3TU Chemnitz, Center for Microtechnologies, ZfM, Reichenhainer Str. 70, 09126 Chemnitz, Germany |
|
|
P38 |
“LOW POWER FORMING GAS (95% N2 : 5%H2) PLASMA TREATMENT OF POROUS LOW- Κ DIELECTRICS TO FACILITATE COPPER DIFFUSION BARRIER LAYER FORMATION” J. Bogan Dublin City University |
|
|
|
|
Poster Session 4: Metallization |
|
|
P4 |
“REACTIVE DYNAMICS SIMULATION OF METALLIC CU AND CU OXIDE ALD FROM THE (NBU3P)2CU(ACAC) PRECURSOR”
Xiao Hu1, Jörg Schuster2, Stefan E. Schulz1, 2 1 Center for Microtechnologies, Chemnitz University of Technology, Germany 2 Fraunhofer Institute for Electronic Nano Systems, Germany |
P6 |
„INVESTIGATION OF NITROGEN INCORPORATION INTO MANGANESE BASED COPPER DIFFUSION BARRIER LAYERS FOR FUTURE INTERCONNECT APPLICATIONS”
V.Selvaraju, A. Brady-Boyd, J. Bogan, R. O’Connor and G. Hughes Surface Sciences Group, School of Physics, Dublin city University, Dublin – 9, Ireland. |
P14 |
“LOW TEMPERATURE ALD OF TITANIUM NITRIDE: LOW RESISTIVITY ENABLED BY ULTRA HIGH PURITY HYDRAZINE”
Dan Alvarez, Jr.,1 Jeffrey J. Spiegelman, Andrew C. Kummel, Steven Wolf, Mahmut Kavrik, Russell Holmes, Mark Raynor, Keisuke Andachi, Hank Shimizu 1RASIRC 7815 Silverton Ave., San Diego, CA 92126 USA |
P17 |
„LOW TEMPERATURE DEPOSITION OF NANOCARBON ON COPPER BY TWO-HEATING-ZONE CVD WITH ETHANOL PRECURSOR”
Takumi Abe1, Hayato Sasauchi1, and Kazuyoshi Ueno1, 2 Shibaura Institute of Technology1, SIT Research Center for Green Innovation2, |
P24 |
“LOW-TEMPERATURE CHEMICAL VAPOR DEPOSITION OF COBALT OXIDE FROM A NOVEL DICOBALTATETRAHEDRANE PRECURSOR”
Colin Georgi1, Marcel Melzer2, Charan K. Nichenametla2, Heinrich Lang3, Stefan E. Schulz1,2 1 Fraunhofer Institute for Electronic Nanosystems, Technologie-Campus 3, 09126 Chemnitz, Germany 2 Chemnitz University of Technology, Center for Microtechnologies, 09126 Chemnitz, Germany 3 Chemnitz University of Technology, Institute of Chemistry, 09126 Chemnitz, Germany |
|
|
Poster Session 5: Nanoscale Devices |
P8 |
“INFLUENCE OF DEFECT-INDUCED DEFORMATIONS ON ELECTRON TRANSPORT IN CARBON NANOTUBES”
Fabian Teichert1;3;5, Christian Wagner1;2, Alexander Croy4, Jörg Schuster3;5 1 Institute of Physics, Technische Universität Chemnitz, Chemnitz, Germany 2 Center for Microtechnologies (ZfM), Technische Universität Chemnitz, Chemnitz, Germany 3 Dresden Center for Computational Materials Science (DCMS), Dresden, Germany 4 Institute for Materials Science and Max Bergmann Center of Biomaterials, Technische Universität Dresden, Dresden, Germany 5 Fraunhofer Institute for Electronic Nano Systems (ENAS), Chemnitz, Germany |
P28 |
“ELECTRICAL CHARACTERIZATION OF SUB-20 NM SILICON NANOWIRES FABRICATED USING ELECTRON BEAM LITHOGRAPHY AND INDUCTIVELY COUPLED PLASMA ETCHING”
Muhammad Bilal Khan1, Dipjyoti Deb1,2, Yordan M. Georgiev1, Artur Erbe1,2 1 Helmholtz-Zentrum Dresden-Rossendorf, 01328 Dresden 2 Center for Advancing Electronics Dresden, 01062 Dresden |
P31 |
“CU-CNT COMPOSITES FROM FABRICATION POINT OF VIEW”
Katharina Lilienthal, Marcus Wislicenus, Nicole Nagy, Benjamin Uhlig Fraunhofer IPMS, Königsbrücker Straße 178, 01099 Dresden |
P34 |
“ELECTRONIC STRUCTURE SIMULATION OF THIN SILICON LAYERS: IMPACT OF ORIENTATION, CONFINEMENT AND STRAIN”
Thomas Joseph1,2, Florian Fuchs2,3,4, Jörg Schuster2,4,5, Stefan E.Schulz1,2,4 1 Center for Microtechnologies, TU Chemnitz, 09126 Chemnitz 2 Fraunhofer Institute for Electronic Nano Systems, 09126 Chemnitz 3 Helmholtz-Zentrum Dresden-Rossendorf, 01314 Dresden 4 Center for Advancing Electronics Dresden, 01062 Dresden 5 Dresden Center for Computational Materials Science, 01062 Dresden |
P42 |
“IMPROVED ENDURANCE OF NONVOLATILE RESISTIVE SWITCHING TO 106 OFF/ON RESISTANCE RATIO IN YTTRIUM MANGANITE THIN FILMS WITH E-BEAM EVAPORATED AL TOP ELECTRODES”
Venkata Rao Rayapati1, Nan Du1,3, Danilo Burger1,3, Ilona Skorupa1,2, Ramona Ecke3, , Oliver G. Schmidt1,4, Heidemarie Schmidt1,3 1 Materials systems for Nanoelectronics, Chemnitz University of Technology, 09126 Chemnitz, Germany—2Helmholtz-Zentrum Dresden-Rossendorf, Institute of Ion Beam Physics and Materials Research, Bautzner Landstrase 400, 01328 Dresden, Germany — 3Fraunhofer-Institut fur Elektronische Nanosysteme, Department Back-End of Line, Technologie- Campus 3, 09126 Chemnitz, Germany—4Institute for Integrative Nanosciences, IFW Dresden, Dresden, Germany
|
P50 |
“RESISTIVE SWITCHING BEHAVIOR OF BIFEO3 AND BIFEO3:TI BASED FILMS ON DIFFERENT BOTTOM ELECTRODE MATERIALS”
Ramona Ecke*1, Tiangui You5, Dawai Shi2, Nan Du1,2, Danilo Bürger1,2, Ilona Skorupa2,3, Stefan E. Schulz1,2, Oliver G. Schmidt2,4 and Heidemarie Schmidt1,2 1°Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany 2 Chemnitz Technical University, Material Systems for Nano Electronics, 09107 Chemnitz, Germany 3 HZDR Innovation GmbH, P.O. Box 510119, 01314 Dresden, Germany 4 Institute for Integrative Nano Sciences, IFW Dresden, 01069 Dresden, Germany 5 State Key Laboratory of Functional Material for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, VR China |
|
|
Poster Session 6: Characterization |
|
|
||
P12 |
„ADVANCED CHARACTERIZATION OF NI ALLOYS AND NI SILICIDES BY IN-LINE WAVELENGTH DISPERSIVE X-RAY FLUORESCENCE”
S. Favier1,2, Ph. Rodriguez2, C. Agraffeil2, H. Fontaine2, E. Nolot2, P. Gergaud2, F. Nemouchi2 1 STMicroelectronics, 850 rue Jean Monnet, BP 16, 38926 Crolles, France 2 Univ. Grenoble Alpes, F-38000 Grenoble, France CEA, LETI, MINATEC Campus, F-38054 Grenoble, France. |
|
|
P30 |
“CRACK-PATH TUNING IN DCB (DOUBLE CANTILEVER BEAM BENDING) AND MELT (MODIFIED EDGE LIFT-OFF TEST) EXPERIMENTS ON BACK-END OF LINE STRUCTURES”
Tabea Flessa, Michael Hecker*, Franz Oestreicher, Kashi V. Machani, Frank Kuechenmeister GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany |
|
|
|
|
Poster Session 7: Flexible / Stretchable Devices |
|
|
||
P46 |
“CORRELATION OF STRUCTURAL, ELECTRICAL AND OPTICAL PROPERTIES OF CONJUGATED POLYMERS ON STRETCHABLE SUBSTRATES UNDER MECHANICAL LOAD”
M. Aliouat1, S. Escoubas1, L. Grodd2, S. Grigorian2, D. Duche1, O. Thomas1 1 Aix-Marseille University, CNRS, IM2NP UMR 7334, Campus de St-Jérôme, 13397 Marseille, France 2Institute of Physics, University of Siegen, Walter-Flex-Strasse 3, D-57068 Siegen, Germany |
|
|