MAM 2017 will be the 26th in a series devoted to research on materials properties and interactions of interconnect and silicide materials. Starting as a workshop on refractory metals and silicides in the 1980’s and moving towards materials for advanced metallization in 1995, the 2017 conference also aims to address new challenges in the fields of materials for stretchable and bendable electronics, emerging nanoscale devices as well as process and device modelling and simulation.
The objective of the conference is to provide a forum for open discussions across fundamental and applied sciences and industrial applications. It is dedicated to international material scientists, process and integration engineers and students, and historically had attendees from universities, research institutions and industries. To meet the progressive downscaling of device dimensions and the demand for more functionality, the challenges fall to material solutions. New and extensive materials research is needed to further allow chip scaling for the 7nm and 5nm nodes as well as to develop novel nanoscale devices.
Keynote presentations and invited talks will be given by scientific and technical leaders in each of the key areas to present the current state-of-the-art and to stimulate technical discussions.