MAM 2017 will be the 26th in a series devoted to research on materials properties and interactions of interconnect and silicide materials.  

The objective of the conference is to provide a forum for open discussions across fundamental and applied sciences and industrial applications. It is dedicated to international material scientists, process and integration engineers and students, and historically had attendees from universities, research institutions and industries. To meet the progressive downscaling of device dimensions and the demand for more functionality, the challenges fall to material solutions. New and extensive materials research is needed to further allow chip scaling for the 7nm and 5nm nodes as well as to develop novel nanoscale devices.

Keynote presentations and invited talks will be given by scientific and technical leaders in each of the key areas to present the current state-of-the-art and to stimulate technical discussions.

Key dates

Conference: March 26-29, 2017

Abstracts due: 20th January 2017 (Abstracts 1/2 page (text only) or 1 page (incl. figures) to be submitted at www.mam-conf.org; Accepted abstracts to be distributed on memory stick at conference)
Paper acceptance: 27th January 2017
Early registration deadline: 26th February 2017
Submission of full length papers: April 15th 2017 (will be published in a special issue of Microelectronic Engineering)